Much like broadcast systems and facilities, telecom systems and facilities have their unique symbols, labels, and documentation conventions. The key to understanding the technology and its application is getting a grip on the language. The keys to designing, specifying, and getting what you want include a basic knowledge of the subject matter and some design tools. The design tools include a computer with word processor, spreadsheet, and drawing capability. For large complex systems and networks, a database manager becomes an important tool for thorough and accurate cost and operations analysis. In addition to these tools, design reference material in the form of recommended practices, standards, product specifications, and data sheets are a must.
Another way of defining telecom infrastructure is a technique called layering. Layering, as used in computer and communications, is best explained as a technique whereby software and digital networks are designed and built in layers. The notion is that if the operational routine or software system is built in layers and each layer interacts or interoperates with the one above and below it, then the entire system is more likely to achieve its overall goals and effectiveness.
Examples of layering include the ISO Open Systems Interconnect model, the four-layer Internet model, and the synchronous optical network/synchronous digital hierarchy (SONET/SDH) four-layer model. These models are three entirely separate models, and while they may not have been created without awareness of each other, taken literally, they don’t appear to have any relationship. Figure 1 shows these three models side by side and how they relate to each other.
Figure 1: Open Systems Interconnect Stack
It’s almost impossible to design, build, and operate a network without some form of integration of all three. For now, take notice of the matching shades of gray—dark, medium, and white. The intention is to use the darker levels to represent the bottom layers and the lighter layers to represent intermediate and top layers in each stack.
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